DocumentCode
2613734
Title
Acceleration Factors for Thin Gate Oxide Stressing
Author
McPherson, J.W. ; Baglee, D.A.
Author_Institution
Texas Instruments, Inc., P.O. Box 1443, MS 649, Houston, Texas 77001
fYear
1985
fDate
31107
Firstpage
1
Lastpage
5
Abstract
Time dependent dielectric breakdown (TDDB) data for 100Ã
of thermally grown SiO2 has been analyzed using an Eyring model based on thermodynamic free energy considerations. The model describes well the following features of the data: (1) an apparent activation energy which is a function of the stressing electric field and (2) a field acceleration parameter that is a function of temperature. Quantitatively, the model suggests the proper field dependence for the activation energy and the observed temperature dependence of the field acceleration in the 100Ã
oxide material. The apparent activation energy is found to decrease from > leV at low field stressing (Eb(50%) - Es > 5 MV/cm) to <0.3eV at higher fields Eb(50%)- Es < 3 MV/cm). Also, the field acceleration was found to be approximately 6 decades/MV/cm at room temperature but reduces to 2 decades/MV/cm at 150C.
Keywords
Acceleration; Breakdown voltage; Capacitors; Circuits; Dielectric breakdown; Dielectric substrates; Electric breakdown; Polarization; Temperature dependence; Thermodynamics;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1985. 23rd Annual
Conference_Location
Orlando, FL, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1985.362066
Filename
4208593
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