DocumentCode
2613988
Title
A Study of Resistance Variations During Electromigration
Author
LaCombe, Donald J. ; Parks, Earl
Author_Institution
Electronics Laboratory, General Electric Company, P.O. Box 4840, Syracuse, New York 13221
fYear
1985
fDate
31107
Firstpage
74
Lastpage
80
Abstract
This paper presents the results of a detailed study of the resistance changes which occur during electromigration. The limitations of resistance monitoring techniques for evaluating susceptibility to electromigration are described. Several stages of test stripe degradation are identified and related to resistance behavior including void formation, multiplication, growth, coalescence, and healing. Arcing cross voids is identified as a potential healing mechanism.
Keywords
Aluminum; Condition monitoring; Conductors; Electric resistance; Electrical resistance measurement; Electromigration; Energy measurement; Laboratories; Metallization; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1985. 23rd Annual
Conference_Location
Orlando, FL, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1985.362079
Filename
4208606
Link To Document