Title :
A Study of Resistance Variations During Electromigration
Author :
LaCombe, Donald J. ; Parks, Earl
Author_Institution :
Electronics Laboratory, General Electric Company, P.O. Box 4840, Syracuse, New York 13221
Abstract :
This paper presents the results of a detailed study of the resistance changes which occur during electromigration. The limitations of resistance monitoring techniques for evaluating susceptibility to electromigration are described. Several stages of test stripe degradation are identified and related to resistance behavior including void formation, multiplication, growth, coalescence, and healing. Arcing cross voids is identified as a potential healing mechanism.
Keywords :
Aluminum; Condition monitoring; Conductors; Electric resistance; Electrical resistance measurement; Electromigration; Energy measurement; Laboratories; Metallization; Testing;
Conference_Titel :
Reliability Physics Symposium, 1985. 23rd Annual
Conference_Location :
Orlando, FL, USA
DOI :
10.1109/IRPS.1985.362079
