Title :
Micro-Corrosion of Al-Cu Bonding Pads
Author :
Thomas, Simon ; Berg, Howard M.
Author_Institution :
Motorola, Inc., 5005 E. McDowell Road, Phoenix, AZ 85008
Abstract :
Aluminum metallization films with copper additions are found to exhibit highly localized pitting in the presence of moisture. Galvanic action of aluminum surrounding Al2Cu theta phase particles causes localized aluminum corrosion. The thin layer of aluminum hydroxide corrosion product on the bonding pad creates an effective barrier to high quality wire bonding.
Keywords :
Aluminum; Assembly; Copper; Corrosion; Integrated circuit interconnections; Metallization; Silicon; Surface topography; Wafer bonding; Wire;
Conference_Titel :
Reliability Physics Symposium, 1985. 23rd Annual
Conference_Location :
Orlando, FL, USA
DOI :
10.1109/IRPS.1985.362091
