Title :
New Filler-Induced Failure Mechanism in Plastic Encapsulated VLSI Dynamic MOS Memories
Author :
Matsumoto, H. ; Yamada, M. ; Fukushima, J. ; Kondoh, T. ; Kotani, N. ; Tosa, M.
Author_Institution :
Mitsubishi Electric Corporation
Abstract :
Fillers in plastic resin can give the local stress to the chip, which causes a single-column-line failure in a sensitive dynamic RAM with marginal sense amplifier circuits. This failure can be improved effectively by employing fillers of small size and/or a buffer coating over the chip.
Keywords :
Ceramics; Circuit testing; Failure analysis; Materials testing; Plastic packaging; Random access memory; Read-write memory; Resins; Semiconductor device packaging; Very large scale integration;
Conference_Titel :
Reliability Physics Symposium, 1985. 23rd Annual
Conference_Location :
Orlando, FL, USA
DOI :
10.1109/IRPS.1985.362095
