Title :
Thermal Fatigue Damage in Pb - In Solder Interconnections
Author :
Agarwala, Birendra N.
Author_Institution :
IBM General Technology Division, East Fishkill, Hopewell Junction, New York 12533
Abstract :
Studies were carried out to determine the mechanism of thermal fatigue damage in Pb-In solder interconnections. Based on experimental studies, a model was developed to express the dependence of thermal fatigue life on the stress variables. The morophology of crack nucleation and propagation and the kinetics of crack growth during thermocycling were investigated from fractographic studies.
Keywords :
Capacitive sensors; Electrical resistance measurement; Fatigue; Integrated circuit interconnections; Metallization; Semiconductor device measurement; Soldering; Temperature dependence; Thermal resistance; Thermal stresses;
Conference_Titel :
Reliability Physics Symposium, 1985. 23rd Annual
Conference_Location :
Orlando, FL, USA
DOI :
10.1109/IRPS.1985.362098
