DocumentCode
2614346
Title
Thermal Fatigue Damage in Pb - In Solder Interconnections
Author
Agarwala, Birendra N.
Author_Institution
IBM General Technology Division, East Fishkill, Hopewell Junction, New York 12533
fYear
1985
fDate
31107
Firstpage
198
Lastpage
205
Abstract
Studies were carried out to determine the mechanism of thermal fatigue damage in Pb-In solder interconnections. Based on experimental studies, a model was developed to express the dependence of thermal fatigue life on the stress variables. The morophology of crack nucleation and propagation and the kinetics of crack growth during thermocycling were investigated from fractographic studies.
Keywords
Capacitive sensors; Electrical resistance measurement; Fatigue; Integrated circuit interconnections; Metallization; Semiconductor device measurement; Soldering; Temperature dependence; Thermal resistance; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1985. 23rd Annual
Conference_Location
Orlando, FL, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1985.362098
Filename
4208625
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