• DocumentCode
    2614406
  • Title

    Why we need statistical static timing analysis

  • Author

    Forzan, Cristiano ; Pandini, Davide

  • Author_Institution
    Central CAD & Design Solutions, STMicroelectronics, Agrate Brianza
  • fYear
    2007
  • fDate
    7-10 Oct. 2007
  • Firstpage
    91
  • Lastpage
    96
  • Abstract
    As technology continues to advance deeper into the nanometer regime, a tight control on the process parameters is increasingly difficult. As a consequence, variability has turned out to be a dominant factor in the design of complex ICs. Traditional static timing analysis (STA) is becoming insufficient to accurately evaluate the process variation impact on the design performance considering the increasing number of process, power supply voltage, and temperature (PVT) corners. In contrast, statistical static timing analysis (SSTA) is a promising innovative technique to handle increasingly larger environmental and process fluctuations, especially on-chip parameter variations. However, the statistical approach needs a set of costly additional data such as an accurate process variation description, and a statistical standard cell library characterization. In this paper, STA and SSTA are applied on a real industrial design to compare the two techniques, in terms of both accuracy and cost. From our analysis, we have concluded that the potential advantages offered by SSTA exceed the additional library characterization cost and process data assembly effort.
  • Keywords
    manufacturing processes; nanotechnology; production engineering computing; statistical analysis; timing; nanometer regime; on-chip parameter variations; power supply voltage; statistical static timing analysis; temperature corners; tight control; Assembly; Costs; Fluctuations; Libraries; Performance analysis; Power supplies; Process control; Temperature; Timing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design, 2007. ICCD 2007. 25th International Conference on
  • Conference_Location
    Lake Tahoe, CA
  • ISSN
    1063-6404
  • Print_ISBN
    978-1-4244-1257-0
  • Electronic_ISBN
    1063-6404
  • Type

    conf

  • DOI
    10.1109/ICCD.2007.4601885
  • Filename
    4601885