Title :
Amdahl’s figure of merit, SiGe HBT BiCMOS, and 3D chip stacking
Author :
Jacobs, Phil ; Zia, Aamir ; Erdogan, Okan ; Belemjian, Paul ; Jin, Peng ; Kim, Jin Woo ; Chu, Mike ; Kraft, Russ ; McDonald, John F.
Author_Institution :
Center for Integrated Electron., Rensselaer Polytech. Inst., Troy, NY
Abstract :
Forty years ago Gene Amdahl published a figure of merit for parallel computation, which proved extremely controversial. The controversy still rages today, although those that have looked closely at this figure of merit conclude that it is correct, but perhaps misinterpreted. In this paper we will look at a small variation on that law that suggests computer designers should take a closer look at two emerging technologies, SiGe HBT BiCMOS and 3D chip stacking. We may be overlooking a way to continue the clock race, and in so doing accomplish better parallelism.
Keywords :
BiCMOS logic circuits; Ge-Si alloys; heterojunction bipolar transistors; integrated circuit design; logic design; microprocessor chips; 3D chip stacking; Amdahl figure of merit; SiGe; SiGe HBT BiCMOS; parallel computation; BiCMOS integrated circuits; Clocks; Concurrent computing; Equations; Germanium silicon alloys; Heterojunction bipolar transistors; Jacobian matrices; Parallel processing; Silicon germanium; Stacking;
Conference_Titel :
Computer Design, 2007. ICCD 2007. 25th International Conference on
Conference_Location :
Lake Tahoe, CA
Print_ISBN :
978-1-4244-1257-0
Electronic_ISBN :
1063-6404
DOI :
10.1109/ICCD.2007.4601901