DocumentCode :
2615052
Title :
Thermo-Mechanical Cycling Behavior of Al Thin-Film Metallization
Author :
Hieber, Hartmann ; Simon, Thore
Author_Institution :
Philips GmbH Forschungslaboratorium Hamburg, Vogt-Koelin-Str. 30, D-2000 Hamburg 54, Germany
fYear :
1986
fDate :
31503
Firstpage :
253
Lastpage :
259
Keywords :
Creep; Electrical resistance measurement; Metallization; Sputtering; Stress measurement; Substrates; Temperature; Thermal stresses; Thermomechanical processes; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1986. 24th Annual
Conference_Location :
Anaheim, CA, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1986.362142
Filename :
4208673
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2615052
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