DocumentCode
2615052
Title
Thermo-Mechanical Cycling Behavior of Al Thin-Film Metallization
Author
Hieber, Hartmann ; Simon, Thore
Author_Institution
Philips GmbH Forschungslaboratorium Hamburg, Vogt-Koelin-Str. 30, D-2000 Hamburg 54, Germany
fYear
1986
fDate
31503
Firstpage
253
Lastpage
259
Keywords
Creep; Electrical resistance measurement; Metallization; Sputtering; Stress measurement; Substrates; Temperature; Thermal stresses; Thermomechanical processes; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1986. 24th Annual
Conference_Location
Anaheim, CA, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1986.362142
Filename
4208673
Link To Document