DocumentCode :
2615168
Title :
The relative performance enhancement of strained-Si and buried channel p-MOS as a function of lithographic and effective gate lengths
Author :
Temple, M.P. ; Paul, D.J. ; Tang, Y.T. ; Waite, A.M. ; Evans, A.G.R. ; O´Neill, A.G. ; Zhang, J. ; Grasby, T. ; Parker, E.H.C.
Author_Institution :
Cavendish Lab., Cambridge Univ., UK
fYear :
2003
fDate :
10-12 Dec. 2003
Firstpage :
51
Lastpage :
52
Abstract :
The relative performance enhancement of strained-Si and buried channel p-MOS as a function of lithographic and effective gate lengths were investigated. Si- pMOS device results are presented from a standard 0.25 μm CMOS process. A SiGe buried channel device on a SiGe virtual substrate is also investigated. With the different diffusion constants for Si and SiGe layers part of this enchancement may be related to differences in channel length. To remove any such effects, the effective gate length (Leff) was extracted using the shift and ratio technique and performance improvements have been compared for both lithographic gate length (Lg) and effective gate length (Leff).
Keywords :
Ge-Si alloys; MOSFET; elemental semiconductors; lithography; silicon; 0.25 micron; CMOS process; Si; SiGe; SiGe buried channel; SiGe virtual substrate; buried channel p-MOS transistor; lithography; CMOS process; Computer science; Educational institutions; Fabrication; Laboratories; MOS devices; MOSFETs; Physics; Solids;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Device Research Symposium, 2003 International
Print_ISBN :
0-7803-8139-4
Type :
conf
DOI :
10.1109/ISDRS.2003.1271991
Filename :
1271991
Link To Document :
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