• DocumentCode
    2615228
  • Title

    Highly Reliable Trench Capacitor With SiO2/Si3N4/SiO2 Stacked Film

  • Author

    Watanabe, T. ; Goto, N. ; Yasuhisa, N. ; Yanase, T. ; Tanaka, T. ; Shinozaki, S.

  • Author_Institution
    Semiconductor Device Engineering Laboratory, Toshiba Corporation, 1, Komukai Toshiba-cho, Saiwai-ku, Kawasaki-city, Japan 210
  • fYear
    1987
  • fDate
    31868
  • Firstpage
    50
  • Lastpage
    54
  • Abstract
    This paper deals with the reliability aspects of trench capacitors with the stacked film of SiO2/Si3N4/Sio2. Trench MOS capacitor shows larger leakage current under positive gate bias compared to plane MOS capacitor, because of the electric field enhancement at Si convex corner. In the case of the stacked film, trapped electrons in Si3N4 relax the electric field near Si corner and suppress the leakage current. The trench MIS capacitor also exhibits higher breakdown voltage of time-zero dielectric breakdown and longer mean time to failure (MTTF) of time dependent dielectric breakdown (TDDB) compared to trench MOS capacitor. Therefore, the stacked film is prominent as an insulator for trench capacitor.
  • Keywords
    Dielectric breakdown; Dielectric measurements; Electrodes; Electrons; Integrated circuit reliability; Leakage current; MOS capacitors; Semiconductor device reliability; Semiconductor films; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1987. 25th Annual
  • Conference_Location
    San Diego, CA, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1987.362154
  • Filename
    4208688