• DocumentCode
    2615231
  • Title

    Structure and stability of alternative gate dielectrics for Si CMOS

  • Author

    Stemmer, Susanne ; Yang, Yan ; Li, Youli ; Foran, Brendan ; Lysaght, Patrick S. ; Gisby, John ; Taylor, Jeff R. ; Streiffer, Stephen K. ; Fuoss, Paul ; Seifert, Soenke ; Zhu, Wenjuan ; Ma, T.P.

  • Author_Institution
    Mater. Dept., California Univ., Santa Barbara, CA, USA
  • fYear
    2003
  • fDate
    10-12 Dec. 2003
  • Firstpage
    60
  • Lastpage
    61
  • Abstract
    The thermodynamic analysis of both interfacial SiO2 and silicide reactions, and phase separation of HfO2 and ZrO2 are performed. The analysis includes gaseous species, because typical gate dielectrics are ultra-thin layers and diffusivities for species from the surrounding atmosphere, such as oxygen, may be high. Calculations for the ZrO2-SiO2 show that compositions between ∼45 mol% and ∼90 mol% SiO2 lie within the metastable extension of the spinodal at typical annealing temperatures of 1000 C. Grazing-incidence small-angle X-ray scattering (GISAXS) and high-resolution transmission electron microscopy (HRTEM) are used to investigate phase separated microstructure in hafnium silicate films after rapid thermal annealing between 700 and 1000 C.
  • Keywords
    CMOS integrated circuits; X-ray scattering; crystal microstructure; dielectric thin films; elemental semiconductors; hafnium compounds; phase separation; rapid thermal annealing; silicon; silicon compounds; thermodynamic properties; transmission electron microscopy; zirconium compounds; 700 to 1000 C; HRTEM; HfO2; Si; Si CMOS; SiO2; ZrO2; alternative gate dielectrics structure; annealing; gaseous species; grazing incidence small angle X-ray scattering; high-resolution transmission electron microscopy; interfacial reactions; metastable extension; phase separated microstructure; phase separation; rapid thermal annealing; silicide reactions; thermodynamic analysis; ultra thin layers; Atmosphere; Dielectrics; Hafnium oxide; Metastasis; Performance analysis; Rapid thermal annealing; Silicides; Stability; Temperature; Thermodynamics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Device Research Symposium, 2003 International
  • Print_ISBN
    0-7803-8139-4
  • Type

    conf

  • DOI
    10.1109/ISDRS.2003.1271995
  • Filename
    1271995