DocumentCode
2615670
Title
Impact of Hot Carriers on Dram Circuits
Author
Duvvury, C. ; Redwine, D. ; Kitagawa, H. ; Haas, R. ; Chuang, Y. ; Beydler, C. ; Hyslop, A
Author_Institution
Texas Instruments Inc., M/S 633, P.O. Box 1443, Houston, Texas 77001
fYear
1987
fDate
31868
Firstpage
201
Lastpage
206
Abstract
Hot carrier stress degradation in MOSFETs is well known but its impact on DRAM circuit functionality has not been thoroughly investigated. In this paper observed DRAM degradation with stress is related to the actual transistor level degradation. It is shown here that the transistor saturation drain current is a good monitor of the DRAM Access Time, while the Precharge Time and the Refresh Time can be related respectively to degradations in the transistor´s linear drive current and the saturation region subthreshold current. As concluded in this paper, transistor parameters other than just Vt and gm need to be monitored with hot carrier stress to understand the full impact on DRAM circuit functionality.
Keywords
CMOS technology; Circuits; Degradation; Drain avalanche hot carrier injection; Electron traps; Hot carriers; MOSFETs; Random access memory; Stress; Substrate hot electron injection;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1987. 25th Annual
Conference_Location
San Diego, CA, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1987.362179
Filename
4208713
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