DocumentCode
2615693
Title
Improvement of Moisture Resistance by Ion-Exchange Process
Author
Mizugashira, S. ; Higuchi, H. ; Ajiki, T.
Author_Institution
Quality Laboratory, Semiconductor Group, Matsushita Electronics Corporation, 1, Kotari Yake-machi, Nagaokakyo, Kyoto, Japan (617) Tel. 075-951-8151
fYear
1987
fDate
31868
Firstpage
212
Lastpage
215
Abstract
To improve the moisture resistance after soldering heat stress for SMD(Surface Mount Device), a new approach introducing the "Ion-exchange process" was succesfully tried out. In this approach, ion-exchanging material(usually called "ion-trap") is added to the molding compound substituting the highly active impurity+ ions+ in the compound by weak ones(ex. Cl- ¿ OH-, Na+ ¿ H+). By applying this process, the lifetime for both cathodic and Al pad corrosion becomes 1.5~3 times longer for the epoxy compounds tested.
Keywords
Corrosion; Crystallization; Lead; Moisture; Packaging; Resistance heating; Silicon compounds; Soldering; Stress; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1987. 25th Annual
Conference_Location
San Diego, CA, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1987.362181
Filename
4208715
Link To Document