• DocumentCode
    2615712
  • Title

    Parameter extraction for HBT´s temperature dependent large signal equivalent circuit model [MMIC oscillator]

  • Author

    Baureis, P. ; Seitzer, D.

  • Author_Institution
    Dept. ICD, Fraunhofer Inst. of Integrated Circuits, Erlangen, Germany
  • fYear
    1993
  • fDate
    10-13 Oct. 1993
  • Firstpage
    263
  • Lastpage
    266
  • Abstract
    An eleven node large signal heterojunction bipolar transistors (HBT) model in hybrid-/spl pi/ configuration is investigated which is derived from HBT topology. This is the first circuit simulation model where the temperature is introduced as a variable simulation parameter using the concept of thermal resistance and pseudotemperature to account for the temperature dependent thermal conductivity of GaAs. The temperature and bias dependence of key model parameters -thermal resistance, transit time, emitter resistance, base-emitter and base-collector junction parameters- are extracted analytically from measured DC and S-parameter data in the temperature range from 20 to 160/spl deg/C using on wafer thermochuck measurements. The devices have f/sub t/ and f/sub max/ values of 40 GHz each. The verification of the proposed model is carried out on a simple oscillator circuit at 4.7 GHz, where the temperature dependence of oscillation frequency and output power of the first three harmonics is compared to measured data.<>
  • Keywords
    III-V semiconductors; MMIC oscillators; S-parameters; aluminium compounds; bipolar MMIC; circuit analysis computing; equivalent circuits; gallium arsenide; heterojunction bipolar transistors; integrated circuit modelling; microwave oscillators; semiconductor device models; thermal resistance; 20 to 160 C; 4.7 GHz; 40 GHz; AlGaAs-GaAs; DC data; GaAs; HBT topology; III-V semiconductors; MMIC oscillator; S-parameter; base-collector junction parameters; base-emitter junction parameters; circuit simulation model; eleven node large-signal model; emitter resistance; harmonics; hybrid-/spl pi/ configuration; large signal equivalent circuit model; on wafer thermochuck measurements; oscillation frequency; oscillator circuit; output power; parameter extraction; pseudotemperature; temperature dependent thermal conductivity; thermal resistance; transit time; Circuit simulation; Electrical resistance measurement; Heterojunction bipolar transistors; Parameter extraction; Semiconductor device modeling; Temperature dependence; Temperature distribution; Thermal conductivity; Thermal resistance; Time measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1993. Technical Digest 1993., 15th Annual
  • Conference_Location
    San Jose, CA, USA
  • Print_ISBN
    0-7803-1393-3
  • Type

    conf

  • DOI
    10.1109/GAAS.1993.394455
  • Filename
    394455