DocumentCode
2616395
Title
RF engineering techniques for a 900 MHz digital cordless telephone service
Author
Smithers, Colin
Author_Institution
PA Technol., Melbourn, UK
fYear
1988
fDate
13-17 Jun 1988
Firstpage
433
Lastpage
435
Abstract
The effect of a low-cost, high-volume market for radio products at 900 MHz on established manufacturing technology is examined. The principal engineering points associated with implementing suitable RF in surface-mount technology on conventional PCB substrate materials and with existing components are outlined
Keywords
radiotelephony; surface mount technology; telephone systems; 900 MHz; PCB substrate materials; RF engineering; UHF; digital cordless telephone service; manufacturing technology; surface-mount technology; Costs; Inductance; Lead; Manufacturing; Printed circuits; Radio frequency; Speech; Surface-mount technology; Telephony; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrotechnics, 1988. Conference Proceedings on Area Communication, EUROCON 88., 8th European Conference on
Conference_Location
Stockholm
Type
conf
DOI
10.1109/EURCON.1988.11194
Filename
11194
Link To Document