Title :
RF engineering techniques for a 900 MHz digital cordless telephone service
Author_Institution :
PA Technol., Melbourn, UK
Abstract :
The effect of a low-cost, high-volume market for radio products at 900 MHz on established manufacturing technology is examined. The principal engineering points associated with implementing suitable RF in surface-mount technology on conventional PCB substrate materials and with existing components are outlined
Keywords :
radiotelephony; surface mount technology; telephone systems; 900 MHz; PCB substrate materials; RF engineering; UHF; digital cordless telephone service; manufacturing technology; surface-mount technology; Costs; Inductance; Lead; Manufacturing; Printed circuits; Radio frequency; Speech; Surface-mount technology; Telephony; Thermal resistance;
Conference_Titel :
Electrotechnics, 1988. Conference Proceedings on Area Communication, EUROCON 88., 8th European Conference on
Conference_Location :
Stockholm
DOI :
10.1109/EURCON.1988.11194
