• DocumentCode
    2616734
  • Title

    Modeling of PGA lines considering electromagnetic coupling based on high frequency measurements

  • Author

    Winkel, T.-M.

  • Author_Institution
    Lab. fuer Informationstechnol., Hanover Univ., Germany
  • fYear
    1993
  • fDate
    20-22 Oct 1993
  • Firstpage
    228
  • Lastpage
    232
  • Abstract
    Electromagnetic coupling of pin-grid array (PGA) lines may cause problems in sensitive circuits. Models that are based upon measurements in a wide frequency range and which consider coupling effects are needed for the estimation of the electrical performance of a package. To enable high-frequency measurements of a four port device under test (DUT) with a two port network analyzer using microwave probes, a complex measurement setup including special contact structures is designed. The complete model of the DUT includes contact structures and lines on both the board, as well as on the chiplevel, the wirebond and pin grid array (PGA)-lines. The contact structures, lines and the wirebonds are modeled separately
  • Keywords
    S-parameters; UHF measurement; microwave measurement; packaging; 15 MHz to 3 GHz; PGA lines modelling; contact structures; electromagnetic coupling; four port device; high-frequency measurements; microwave probes; package electrical performance; two port network analyzer; Circuits; Contacts; Electromagnetic coupling; Electromagnetic measurements; Electromagnetic modeling; Electronics packaging; Frequency estimation; Frequency measurement; Microwave measurements; Semiconductor device measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 1993
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    0-7803-1427-1
  • Type

    conf

  • DOI
    10.1109/EPEP.1993.394548
  • Filename
    394548