DocumentCode
2616734
Title
Modeling of PGA lines considering electromagnetic coupling based on high frequency measurements
Author
Winkel, T.-M.
Author_Institution
Lab. fuer Informationstechnol., Hanover Univ., Germany
fYear
1993
fDate
20-22 Oct 1993
Firstpage
228
Lastpage
232
Abstract
Electromagnetic coupling of pin-grid array (PGA) lines may cause problems in sensitive circuits. Models that are based upon measurements in a wide frequency range and which consider coupling effects are needed for the estimation of the electrical performance of a package. To enable high-frequency measurements of a four port device under test (DUT) with a two port network analyzer using microwave probes, a complex measurement setup including special contact structures is designed. The complete model of the DUT includes contact structures and lines on both the board, as well as on the chiplevel, the wirebond and pin grid array (PGA)-lines. The contact structures, lines and the wirebonds are modeled separately
Keywords
S-parameters; UHF measurement; microwave measurement; packaging; 15 MHz to 3 GHz; PGA lines modelling; contact structures; electromagnetic coupling; four port device; high-frequency measurements; microwave probes; package electrical performance; two port network analyzer; Circuits; Contacts; Electromagnetic coupling; Electromagnetic measurements; Electromagnetic modeling; Electronics packaging; Frequency estimation; Frequency measurement; Microwave measurements; Semiconductor device measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1993
Conference_Location
Monterey, CA
Print_ISBN
0-7803-1427-1
Type
conf
DOI
10.1109/EPEP.1993.394548
Filename
394548
Link To Document