Analysis of the effects of mounting stresses on the resonant frequency of crystal resonators

Author

Stewart, J.T. ; Stevens, D.S.

Author_Institution

Vectron Technol. Inc., Hudson, NH, USA

fYear

1997

fDate

28-30 May 1997

Firstpage

621

Lastpage

629

Abstract

A general finite element method has been developed for the analysis of the effects of thermally induced mounting stresses on the resonant frequency of crystal resonators. The present study analyzes this behavior using a finite element model to obtain an accurate description of the thermal stresses and deformations in a crystal plate that has been mounted in various configurations using an adhesive to bond the quartz to a ceramic base. This solution is then combined with an analytical solution of the vibration mode shape for a harmonic of thickness shear in a general perturbation procedure to obtain the frequency shift. The methods developed herein are useful for studying the sensitivity of a particular mounting scheme to thermal stresses for small temperature excursions. Examples of circular AT Cut crystal plates mounted in various configurations are studied

Keywords

crystal resonators; finite element analysis; perturbation theory; thermal stresses; SiO₂; adhesive bond; ceramic base; circular AT cut crystal plate; crystal resonator; deformation; finite element method; mounting stress; perturbation method; quartz; resonant frequency shift; thermal stress; thickness shear harmonic; vibration mode shape; Bonding; Ceramics; Deformable models; Finite element methods; Harmonic analysis; Resonance; Resonant frequency; Shape; Temperature sensors; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Frequency Control Symposium, 1997., Proceedings of the 1997 IEEE International

Conference_Location

Orlando, FL

Print_ISBN

0-7803-3728-X

Type

conf

DOI

10.1109/FREQ.1997.638727

Filename

638727