Title :
The effect of irradiation temperature on post-irradiation strain levels in GexSi1-x/Si strained layer heterostructures
Author :
Glasko, J.M. ; Zou, J. ; Cockayne, D.J.H. ; Gerald, J. Fitz ; Elliman, R.G.
Author_Institution :
Dept. of Electron. Mater. Eng., Australian Nat. Univ., Canberra, ACT, Australia
Abstract :
Double crystal X-ray diffraction (DCXRD), transmission electron microscopy (TEM), and Rutherford backscattering spectroscopy and channelling (RBS-C) were used to study the effect of irradiation temperature and ion-energy on the perpendicular strain (ε⊥) in GexSi1-x/Si strained layer heterostructures. Room temperature irradiation was shown to increase ε⊥. This effect was adequately modelled by assuming that irradiation caused additional strain due to excess interstitial distribution. The effects of irradiating at 253°C were more complex, resulting in: (a) an increase in ε⊥ when the radiation damage profile was confined to the alloy layer; or (b) a decrease in ε⊥ when the damage profile extended through the alloy/substrate interface. Strain relaxation at elevated temperature is believed to be effected by loop-like defects which nucleate at or near the alloy/substrate interface during high energy irradiation
Keywords :
Ge-Si alloys; Rutherford backscattering; X-ray diffraction; channelling; deformation; elemental semiconductors; interstitials; ion beam effects; semiconductor heterojunctions; semiconductor materials; silicon; transmission electron microscopy; GeSi-Si; Rutherford backscattering spectroscopy; alloy/substrate interface; channelling; damage profile; double crystal X-ray diffraction; interstitial distribution; ion irradiation temperature; loop-like defect nucleation; perpendicular strain; strain relaxation; strained layer heterostructure; transmission electron microscopy; Australia; Backscatter; Capacitive sensors; Electron microscopy; Lattices; Spectroscopy; Substrates; Temperature; Transmission electron microscopy; X-ray diffraction;
Conference_Titel :
Optoelectronic and Microelectronic Materials And Devices Proceedings, 1996 Conference on
Conference_Location :
Canberra, ACT
Print_ISBN :
0-7803-3374-8
DOI :
10.1109/COMMAD.1996.610092