Title :
RF/microwave flip chip technology
Author :
Reyes, Adolfo C. ; Patterson, Howard W ; Dorn, Steve J. ; Dydyk, Michael
Author_Institution :
Motorola, Inc., Phoenix, AZ, USA
Abstract :
Summary form only given. An alternate approach to wire bond interconnects is flip chip technology. Ultimately, coplanar waveguide rather than microstrip transmission lines are utilized in the die and package designs. The metrology of characterization and measured results of RF/microwave circuit elements under flip chip conditions are addressed
Keywords :
coplanar waveguides; flip-chip devices; integrated circuit design; integrated circuit packaging; lead bonding; microwave integrated circuits; microwave measurement; RF/microwave circuit elements; RF/microwave flip chip technology; coplanar waveguide; die design; metrology; microstrip transmission lines; package designs; wire bond interconnects; Bonding; Coplanar transmission lines; Coplanar waveguides; Distributed parameter circuits; Flip chip; Integrated circuit interconnections; Microstrip; Microwave technology; Radio frequency; Wire;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-1427-1
DOI :
10.1109/EPEP.1993.394564
