Title :
Room temperature wafer bonding by elastomeric polymer-supported cold welding
Author :
Zhang, W.Y. ; Ferguson, G.S. ; Tatic-Lucic, S.
Author_Institution :
Dept. of Electr. & Comput. Eng., Lehigh Univ., Bethlehem, PA, USA
Abstract :
Elastomer supported cold welding is applied as a wafer bonding technique. By placing the elastomeric polymer layer beneath the metal contact surfaces, two silicon wafers under limited load (∼ 3 KPa) at 25 °C. This method for room temperature wafer bonding without applying a voltage, high pressure, or vacuum is applicable for MEMS and NEMS packaging and fabrication processes.
Keywords :
elastomers; elemental semiconductors; micromechanical devices; silicon; wafer bonding; welding; 25 degC; 293 to 298 K; MEMS packaging; NEMS packaging; Si; cold welding; elastomeric polymer; metal contact surface; room temperature wafer bonding; silicon wafers; Fabrication; Micromechanical devices; Nanoelectromechanical systems; Packaging; Polymers; Silicon; Temperature; Voltage; Wafer bonding; Welding;
Conference_Titel :
Semiconductor Device Research Symposium, 2003 International
Print_ISBN :
0-7803-8139-4
DOI :
10.1109/ISDRS.2003.1272100
