Title :
Directions in silicon-on-silicon MCMs
Author_Institution :
AT&T Bell Lab., Murray Hill, NJ
Abstract :
The author reports on research on silicon-based multi-chip module (MCM) technology at AT&T Bell Laboratories, including cost-driven mixed signal applications and the benefits of re-designing chips specifically for the low loading environment of MCMs
Keywords :
elemental semiconductors; integrated circuit design; mixed analogue-digital integrated circuits; multichip modules; silicon; Si-Si; chip design; cost-driven mixed signal; low loading environment; multichip module; semiconductor; Bandwidth; CMOS technology; Costs; Electronics packaging; Explosives; Integrated circuit interconnections; Power system interconnection; Silicon; Very large scale integration; Wafer scale integration;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-1427-1
DOI :
10.1109/EPEP.1993.394565
