DocumentCode
2617118
Title
Simulation of interconnection and package interaction phenomena in MMIC´s by FDTD
Author
Mezzanotte, P. ; Roselli, L. ; Sorrentino, R.
Author_Institution
Inst. of Electron., Perugia Univ., Italy
fYear
1993
fDate
20-22 Oct 1993
Firstpage
139
Lastpage
142
Abstract
The finite difference time domain (FDTD) method is used to characterize packaged microstrip circuits, including the interconnections to coaxial lines. The results of isolated and coupled via-holes agree very well with the experiments, and show that package interaction phenomenon are accurately predicted
Keywords
MMIC; circuit analysis computing; finite difference time-domain analysis; integrated circuit interconnections; integrated circuit packaging; microstrip circuits; FDTD method; coaxial lines; coupled via-holes; finite difference time domain method; interconnection-package interaction phenomena simulation; isolated via holes; package interaction phenomenon; packaged microstrip circuits; Circuit simulation; Coupling circuits; Electronics packaging; Finite difference methods; Geometry; Integrated circuit interconnections; MMICs; RLC circuits; Resonance; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1993
Conference_Location
Monterey, CA
Print_ISBN
0-7803-1427-1
Type
conf
DOI
10.1109/EPEP.1993.394570
Filename
394570
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