Title :
Simulation of interconnection and package interaction phenomena in MMIC´s by FDTD
Author :
Mezzanotte, P. ; Roselli, L. ; Sorrentino, R.
Author_Institution :
Inst. of Electron., Perugia Univ., Italy
Abstract :
The finite difference time domain (FDTD) method is used to characterize packaged microstrip circuits, including the interconnections to coaxial lines. The results of isolated and coupled via-holes agree very well with the experiments, and show that package interaction phenomenon are accurately predicted
Keywords :
MMIC; circuit analysis computing; finite difference time-domain analysis; integrated circuit interconnections; integrated circuit packaging; microstrip circuits; FDTD method; coaxial lines; coupled via-holes; finite difference time domain method; interconnection-package interaction phenomena simulation; isolated via holes; package interaction phenomenon; packaged microstrip circuits; Circuit simulation; Coupling circuits; Electronics packaging; Finite difference methods; Geometry; Integrated circuit interconnections; MMICs; RLC circuits; Resonance; Time domain analysis;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-1427-1
DOI :
10.1109/EPEP.1993.394570
