• DocumentCode
    2617142
  • Title

    Efficient computation of ground plane inductances and currents

  • Author

    Raghuram, Raj ; Divekar, Dileep ; Wang, Paul

  • Author_Institution
    CONTEC Microelectronics, San Jose, CA, USA
  • fYear
    1993
  • fDate
    20-22 Oct 1993
  • Firstpage
    131
  • Lastpage
    134
  • Abstract
    An efficient method for calculating an inductance subcircuit from a 3-D geometry containing reference planes is presented. The complexity is reduced to O(n2log(n)) compared to O(n6) for a direct implementation
  • Keywords
    SPICE; electric current; electromagnetic interference; fast Fourier transforms; inductance; integrated circuit packaging; 3D geometry; EMI; FFT; SPICE; ground plane current; ground plane inductances; inductance subcircuit; integrated circuits; Computer aided engineering; Electromagnetic interference; Impedance; Inductance; Inductors; Microelectronics; SPICE; Solids; USA Councils; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 1993
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    0-7803-1427-1
  • Type

    conf

  • DOI
    10.1109/EPEP.1993.394572
  • Filename
    394572
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2617142