DocumentCode :
2617142
Title :
Efficient computation of ground plane inductances and currents
Author :
Raghuram, Raj ; Divekar, Dileep ; Wang, Paul
Author_Institution :
CONTEC Microelectronics, San Jose, CA, USA
fYear :
1993
fDate :
20-22 Oct 1993
Firstpage :
131
Lastpage :
134
Abstract :
An efficient method for calculating an inductance subcircuit from a 3-D geometry containing reference planes is presented. The complexity is reduced to O(n2log(n)) compared to O(n6) for a direct implementation
Keywords :
SPICE; electric current; electromagnetic interference; fast Fourier transforms; inductance; integrated circuit packaging; 3D geometry; EMI; FFT; SPICE; ground plane current; ground plane inductances; inductance subcircuit; integrated circuits; Computer aided engineering; Electromagnetic interference; Impedance; Inductance; Inductors; Microelectronics; SPICE; Solids; USA Councils; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-1427-1
Type :
conf
DOI :
10.1109/EPEP.1993.394572
Filename :
394572
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2617142
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