Title :
Spectral domain quasi-TEM computation of the propagation characteristics of single and coupled interconnects with meshed ground planes
Author :
Luo, S. ; Jong, J.M. ; Tripathi, V.K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
Abstract :
The impedances, wave velocities and crosstalk coupling coefficients for interconnects with rectangular meshed ground planes are calculated by using the quasi-transverse electromagnetic wave (TEM) spectral domain technique. The impedance calculated are compared with measured data as a function of the mesh size and the trace position and direction with respect to the mesh plane orientation
Keywords :
crosstalk; electromagnetic wave propagation; integrated circuit interconnections; integrated circuit packaging; mesh generation; multichip modules; spectral-domain analysis; MCM; coupled interconnects; crosstalk coupling coefficients; impedances; mesh plane orientation; mesh size; multilayer electronic package; propagation characteristics; quasi-TEM spectral domain technique; rectangular meshed ground planes; single interconnects; transverse electromagnetic wave; wave velocities; Apertures; Dielectric constant; Dielectric measurements; Impedance measurement; Packaging; Position measurement; Semiconductor device measurement; Size measurement; Thermal management; Transmission lines;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-1427-1
DOI :
10.1109/EPEP.1993.394573
