• DocumentCode
    2617168
  • Title

    Exploiting symmetry in the extraction of electrical packaging parameters

  • Author

    Huang, Ching-Chao

  • Author_Institution
    IBM Raleigh, Research Triangle Park, NC, USA
  • fYear
    1993
  • fDate
    20-22 Oct 1993
  • Firstpage
    125
  • Lastpage
    127
  • Abstract
    The author examines three different aspects of exploiting a structure´s symmetry to efficiently compute electrical packaging parameters: (a) recognizing the cross-sectional symmetry eases the numerical integration of 3-D partial inductances; (b) the direct inversion of a partial impedance matrix lets one take advantage of a structure´s symmetry in computing resistance and inductance matrices of uniformly coupled transmission lines; and (c) an almost symmetric and/or periodic structure can be either decomposed or augmented to exploit the special property of its corresponding system matrix
  • Keywords
    electric impedance; inductance; integration; matrix inversion; network parameters; packaging; skin effect; symmetry; 3D partial inductance; CPV time; cross-sectional symmetry; direct inversion; electrical packaging parameters; inductance matrices; numerical integration; partial impedance matrix; periodic structure; resistance matrix; skin effect; system matrix; uniformly coupled transmission lines; Conductors; Electric resistance; Geometry; Impedance; Inductance; Matrix decomposition; Packaging; Periodic structures; Symmetric matrices; Transmission line matrix methods;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 1993
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    0-7803-1427-1
  • Type

    conf

  • DOI
    10.1109/EPEP.1993.394574
  • Filename
    394574