DocumentCode
2617281
Title
A new three dimensional finite difference time domain (3D-FDTD) simulator for modelling electronic interconnections and packaging
Author
Lu, Lynda X. ; Wu, Chen ; Litva, John
Author_Institution
Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
fYear
1993
fDate
20-22 Oct 1993
Firstpage
92
Lastpage
95
Abstract
It has been shown that the finite difference time domain (FDTD) method is an accurate and flexible technique to simulate complex electromagnetic problems. A 3D-FDTD software package is introduced. It can be used to simulate electronic packaging problems from an electromagnetic field point of view
Keywords
circuit CAD; circuit analysis computing; finite difference time-domain analysis; integrated circuit interconnections; integrated circuit packaging; 3D-FDTD software package; electromagnetic problems; electronic interconnections modelling; electronic packaging simulation; three dimensional finite difference time domain simulator; Electronics packaging; Finite difference methods; Frequency domain analysis; Graphics; Integrated circuit interconnections; Maxwell equations; Mesh generation; Predictive models; Software packages; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1993
Conference_Location
Monterey, CA
Print_ISBN
0-7803-1427-1
Type
conf
DOI
10.1109/EPEP.1993.394582
Filename
394582
Link To Document