Title :
SPICE simulation of VLSI interconnects modeled by transmission lines with skin effects
Author :
Yu, Qingjian ; Wing, Omar
Author_Institution :
Fac. of Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
Abstract :
A lossy transmission line with skin effects is modeled as a characteristic 2-port. The characteristic impedance and propagation function, including the skin effect √s, are approximated as rational impedances or transfer functions determined analytically with error control
Keywords :
SPICE; VLSI; circuit analysis computing; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; skin effect; transfer functions; transmission line theory; SPICE simulation; VLSI interconnects modelling; characteristic impedance; characteristic two-post circuit; lossy transmission line; propagation function; skin effects; transfer functions; Delay effects; Distributed parameter circuits; Frequency; Impedance; Lattices; SPICE; Skin effect; Transfer functions; Transmission lines; Very large scale integration;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-1427-1
DOI :
10.1109/EPEP.1993.394583
