Title :
A signal integrity advisor for automated packaging design
Author :
Simovich, Slobodaa ; Mehrotra, Sharad ; Franzon, Paul ; Steer, Michael ; Rakib, Zaki ; Simpson, Garrett
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., NC, USA
Abstract :
A new methodology is presented in which the signal integrity engineer and the design engineer interact with automation tools to produce a printed circuit board (PCB) or multi-chip module (MCM) layout. The focus is on how the signal integrity engineer uses these tools for greatest success
Keywords :
circuit layout CAD; design engineering; multichip modules; printed circuit layout; MCM layout; PCB layout; automated packaging design; automation tools; multichip module; printed circuit board; signal integrity advisor; Circuit noise; Contacts; Design automation; Design engineering; Driver circuits; Logic design; Multichip modules; Packaging; Printed circuits; Signal design;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-1427-1
DOI :
10.1109/EPEP.1993.394591
