DocumentCode
2617389
Title
A signal integrity advisor for automated packaging design
Author
Simovich, Slobodaa ; Mehrotra, Sharad ; Franzon, Paul ; Steer, Michael ; Rakib, Zaki ; Simpson, Garrett
Author_Institution
Dept. of Electr. & Comput. Eng., North Carolina State Univ., NC, USA
fYear
1993
fDate
20-22 Oct 1993
Firstpage
55
Lastpage
57
Abstract
A new methodology is presented in which the signal integrity engineer and the design engineer interact with automation tools to produce a printed circuit board (PCB) or multi-chip module (MCM) layout. The focus is on how the signal integrity engineer uses these tools for greatest success
Keywords
circuit layout CAD; design engineering; multichip modules; printed circuit layout; MCM layout; PCB layout; automated packaging design; automation tools; multichip module; printed circuit board; signal integrity advisor; Circuit noise; Contacts; Design automation; Design engineering; Driver circuits; Logic design; Multichip modules; Packaging; Printed circuits; Signal design;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1993
Conference_Location
Monterey, CA
Print_ISBN
0-7803-1427-1
Type
conf
DOI
10.1109/EPEP.1993.394591
Filename
394591
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