A novel technique for analyzing periodic structures in high speed electronic packaging

Author

Swaminathan, Madhavan ; Petre, Peter

Author_Institution

IBM, Hopewell Jct., E. Fishkill, NY, USA

fYear

1993

fDate

20-22 Oct 1993

Firstpage

43

Lastpage

46

Abstract

A technique is presented to accurately characterize periodic structures in high-speed electronic packages. A single algorithm can be used to compute the radiation from or propagation on periodic structures by varying the angle of the incident wave. The algorithm has a wide application ranging from electromagnetic interference (EMI) to wave transmission in electronic packages. Details on the formulation, application to wave propagation, results and an extension to the use of the method for analysis of scattering from periodic structures are presented

Keywords

electromagnetic interference; electromagnetic wave scattering; iterative methods; method of moments; microstrip lines; packaging; spectral-domain analysis; EMI; algorithm; electromagnetic interference; high-speed electronic packages; incident wave angle; iterative technique; microstrip lines; periodic structures; scattering analysis; spectral domain approach; surface wave excitation; wave propagation; wave transmission; Electromagnetic propagation; Electromagnetic scattering; Electronics packaging; High-speed electronics; Integral equations; Integrated circuit packaging; Periodic structures; Software packages; Transmission line matrix methods; USA Councils;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1993

Conference_Location

Monterey, CA

Print_ISBN

0-7803-1427-1

Type

conf

DOI

10.1109/EPEP.1993.394594

Filename

394594