Calculation of multi-port parameters of electronic packages using a general purpose electromagnetics code

Author

Rubin, Barry J. ; Daijavad, Shahrokh

Author_Institution

IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA

fYear

1993

fDate

20-22 Oct 1993

Firstpage

37

Lastpage

39

Abstract

A powerful code developed by the authors to solve radiation and scattering problems from arbitrary 3D dielectric-conductor structures is modified to provide the terminal characteristics of arbitrary package structures. By incorporating a general de-embedding procedure to eliminate end effects, Y- and S-parameters can be obtained for 3D transmission-line structures; other parameters such as the C and L matrices can also be obtained. Results for microstrip twin-tee and mesh-plane structures are presented and compared with results already in the literature

Keywords

S-parameters; circuit analysis computing; microstrip lines; multiport networks; packaging; transmission line matrix methods; 3D transmission-line structures; C matrices; L matrices; S-parameters; arbitrary 3D dielectric-conductor structures; electronic packages; end effects; general de-embedding procedure; general purpose electromagnetics code; mesh-plane structures; microstrip twin-tee structures; multiport parameters; radiation problems Y-parameters; scattering problems; terminal characteristics; Dielectrics; Electromagnetic analysis; Electromagnetic radiation; Electromagnetic scattering; Electronics packaging; Equations; Optical polarization; Surface impedance; Transmission line matrix methods; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1993

Conference_Location

Monterey, CA

Print_ISBN

0-7803-1427-1

Type

conf

DOI

10.1109/EPEP.1993.394596

Filename

394596