Title :
Calculation of multi-port parameters of electronic packages using a general purpose electromagnetics code
Author :
Rubin, Barry J. ; Daijavad, Shahrokh
Author_Institution :
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
A powerful code developed by the authors to solve radiation and scattering problems from arbitrary 3D dielectric-conductor structures is modified to provide the terminal characteristics of arbitrary package structures. By incorporating a general de-embedding procedure to eliminate end effects, Y- and S-parameters can be obtained for 3D transmission-line structures; other parameters such as the C and L matrices can also be obtained. Results for microstrip twin-tee and mesh-plane structures are presented and compared with results already in the literature
Keywords :
S-parameters; circuit analysis computing; microstrip lines; multiport networks; packaging; transmission line matrix methods; 3D transmission-line structures; C matrices; L matrices; S-parameters; arbitrary 3D dielectric-conductor structures; electronic packages; end effects; general de-embedding procedure; general purpose electromagnetics code; mesh-plane structures; microstrip twin-tee structures; multiport parameters; radiation problems Y-parameters; scattering problems; terminal characteristics; Dielectrics; Electromagnetic analysis; Electromagnetic radiation; Electromagnetic scattering; Electronics packaging; Equations; Optical polarization; Surface impedance; Transmission line matrix methods; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-1427-1
DOI :
10.1109/EPEP.1993.394596
