Title :
Flip chip interconnect of 2.5-watt CPW power amplifier MMIC
Author :
Pao, C.K. ; Wong, W.S. ; Gray, W.D. ; Liu, C. ; Wang, D.C. ; Wen, C.P.
Author_Institution :
Hughes Aircraft Co., Torrance, CA, USA
Abstract :
A monolithic X-band coplanar waveguide power amplifier utilizing high yield flip chip interconnect technology has been designed and fabricated. A peak power of 2.5 watts with a power added efficiency better than 24% at 8 GHz has been achieved
Keywords :
MESFET integrated circuits; MMIC power amplifiers; coplanar waveguides; flip-chip devices; integrated circuit design; integrated circuit packaging; integrated circuit technology; power amplifiers; waveguide components; 2.5 W; 24 percent; 8 GHz; high yield flip chip interconnect technology; monolithic X-band coplanar waveguide power amplifier; peak power; power added efficiency; Coplanar waveguides; Dielectric substrates; Flip chip; Gallium arsenide; High power amplifiers; Integrated circuit interconnections; MMICs; Power amplifiers; Radar antennas; Robotic assembly;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-1427-1
DOI :
10.1109/EPEP.1993.394598
