DocumentCode :
2617511
Title :
Electrical characterization of the subthreshold damage in ion implanted p-type silicon
Author :
Fatima, S. ; Jagadish, C.
Author_Institution :
Dept. of Electron. Mater. Eng., Australian Nat. Univ., Canberra, ACT, Australia
fYear :
1996
fDate :
8-11 Dec 1996
Firstpage :
158
Lastpage :
161
Abstract :
The residual electrically active defects in implanted and annealed p-type Si (boron doped) have been studied with capacitance-voltage (CV) measurements and deep level transient spectroscopy (DLTS). P-type Si is implanted with 5.5 MeV Si ions to doses between 1012 and 10 14 cm-2. These samples were annealed at elevated temperatures (900°C). A critical dose is established indicating the transformation between point defects in to extended defects in contrast to n-type Si where a critical dose has been established for same species and under same annealing conditions below which no electrically active defects are seen
Keywords :
annealing; deep level transient spectroscopy; defect states; elemental semiconductors; ion implantation; silicon; 5.5 MeV; 900 C; Si; annealing; boron doped p-type Si; capacitance-voltage measurement; critical dose; deep level transient spectroscopy; extended defect; ion implantation; point defect; residual electrically active defect; subthreshold damage; Boron; Capacitance measurement; Capacitance-voltage characteristics; Electric variables measurement; Fabrication; Ion implantation; Rapid thermal annealing; Silicon; Spectroscopy; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Optoelectronic and Microelectronic Materials And Devices Proceedings, 1996 Conference on
Conference_Location :
Canberra, ACT
Print_ISBN :
0-7803-3374-8
Type :
conf
DOI :
10.1109/COMMAD.1996.610096
Filename :
610096
Link To Document :
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