Performance comparison of single- and multiple-chip packages in a personal computer application

Author

Cases, Moises

Author_Institution

IBM Corp., Boca Raton, FL, USA

fYear

1993

fDate

20-22 Oct 1993

Firstpage

9

Lastpage

11

Abstract

The multi-chip module (MCM) package shows considerable improvement in performance and signal quality as compared to single-chip modules on cards. It can support 40-45% faster clock rates due to reduced clock skews and distortions. It also yields 40-45% better net delays due to reduced capacitance loading, reduced effective time-of-flight delays, and shorter chip interconnect distances. The MCM package shows signal quality improvements for specific net cross sections due to reduced effective loadings, and a better controlled system. It also yields better electrical characteristic tolerances

Keywords

integrated circuit packaging; microcomputers; multichip modules; Intel 486 microprocessor; MCM package; capacitance loading; chip interconnect distances; clock rates; clock skews; distortions; effective time-of-flight delays; electrical characteristic tolerances; multichip module package; personal computer; signal quality; single-chip modules; Application software; Bonding; Clocks; Crosstalk; Delay effects; Frequency; Logic; Microcomputers; Packaging; Parasitic capacitance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1993

Conference_Location

Monterey, CA

Print_ISBN

0-7803-1427-1

Type

conf

DOI

10.1109/EPEP.1993.394603

Filename

394603