DocumentCode :
2618072
Title :
Sensitivity analysis on causal events of wip bubbles by a log-driven simulator
Author :
Hirade, Ryo ; Raymond, Rudy ; Okano, Hiroyuki
Author_Institution :
Tokyo Res. Lab., Yamato
fYear :
2007
fDate :
9-12 Dec. 2007
Firstpage :
1747
Lastpage :
1754
Abstract :
Fluctuations of work-in-progress (WIP) levels cause variability of cycle time and often lead to productivity losses in semiconductor wafer fabrication plants. To identify sources of such variability, we are developing a root cause analysis tool with history logs of operational events, such as high WIP or equipment downtime, as inputs to automatically find the chains of events that create the variability. In the root cause analysis, one of the key steps is to aggregate the observed events into groups that are likely in cause-effect relationships. For operational events that involve time lags in cause-effect relationships, grouping the events requires identification of the time windows of causality based on discrete event simulations. This paper describes a design and implementation of a simulator for this purpose. The simulator does not assume any statistical or mathematical model, and thus is simple to maintain.
Keywords :
cause-effect analysis; discrete event simulation; electronics industry; graph theory; integrated circuit manufacture; production engineering computing; productivity; sensitivity analysis; work in progress; causal events; causality; cause-effect relationship; cycle time variability; discrete event simulation; equipment downtime; log-driven simulator; operational events; productivity loss; root cause analysis tool; semiconductor wafer fabrication plants; sensitivity analysis; work-in-progress; Aggregates; Analytical models; Discrete event simulation; Fabrication; Fluctuations; History; Lead compounds; Mathematical model; Productivity; Sensitivity analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation Conference, 2007 Winter
Conference_Location :
Washington, DC
Print_ISBN :
978-1-4244-1306-5
Electronic_ISBN :
978-1-4244-1306-5
Type :
conf
DOI :
10.1109/WSC.2007.4419798
Filename :
4419798
Link To Document :
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