Title :
Hierarchical distributed simulation for 300mm wafer fab
Author :
Xu, Sheng ; McGinnis, Leon F.
Author_Institution :
Georgia Inst. of Technol., Atlanta
Abstract :
Distributed simulation promises benefits in large-scale simulations, such as in high fidelity simulation of 300 mm wafer fabs, although these benefits have been hard to achieve in practice. This paper examines the fundamentals of distributed simulation, and proposes a hierarchical approach to distributed wafer fab simulation, which has the potential to achieve significant reduction in model execution time.
Keywords :
digital simulation; distributed processing; production engineering computing; semiconductor device manufacture; wafer-scale integration; hierarchical distributed simulation; high fidelity simulation; large-scale simulations; wafer fab; Analytical models; Computational modeling; Discrete event simulation; Distributed computing; Industrial engineering; Large-scale systems; Manufacturing systems; Semiconductor device modeling; Synchronization; Systems engineering and theory;
Conference_Titel :
Simulation Conference, 2007 Winter
Conference_Location :
Washington, DC
Print_ISBN :
978-1-4244-1305-8
Electronic_ISBN :
978-1-4244-1306-5
DOI :
10.1109/WSC.2007.4419802