Title :
Effects of the Meetings-Flow Approach on Quality Teamwork in the Training of Software Capstone Projects
Author :
Chung-Yang Chen ; Ya-Chun Hong ; Pei-Chi Chen
Author_Institution :
Dept. of Inf. Manage., Nat. Central Univ., Jhongli, Taiwan
Abstract :
Software development relies heavily on teamwork; determining how to streamline this collaborative development is an essential training subject in computer and software engineering education. A team process known as the meetings-flow (MF) approach has recently been introduced in software capstone projects in engineering programs at various institutions. In undergraduate science, technology, engineering, and mathematics (STEM) curricula that emphasize team- and project-based learning, the MF approach serves as a macro-level instructional tool to guide students in holistically designing and directing collaborative project development. Previous studies on MF have shown the technical benefits of monitoring student work and product quality. This study investigated the approach further, from the perspective of team management. The effects of MF were examined through an experiment with team-related hypotheses. The results revealed that MF significantly enhances a team´s communication and coordination and balances members´ contributions by giving mutual support and effort. It has relatively less influence, however, on student team cohesion.
Keywords :
computer science education; educational courses; software development management; team working; training; engineering programs; meetings-flow approach; software capstone project course; software capstone project training; student team cohesion; team communication enhancement; team coordination enhancement; team management; team process; team-based software development; Analysis of variance; Collaborative work; Context; Software; Teamwork; Training; Capstone projects; computer engineering education; experiment; meetings-flow (MF); teamwork quality; undergraduate science, technology, engineering, and mathematics (STEM) program;
Journal_Title :
Education, IEEE Transactions on
DOI :
10.1109/TE.2014.2305918