DocumentCode
2618581
Title
Application of dynamic manufacturing service provisioning mechanism to delivery commitment
Author
Su, Yea-Huey ; Chang, Shi-Chug ; Guo, Ruey-Shan ; Lai, Yi Chang
Author_Institution
Graduate Inst. of Bus. Adm., Nat. Taiwan Univ., Taipei, Taiwan
fYear
2000
fDate
2000
Firstpage
107
Lastpage
117
Abstract
The concept of “virtual fab” emphasizes manufacturing service provisioning. This paper designs a dynamic manufacturing service provisioning mechanism (DMSPM) for the creation, deployment, and execution of manufacturing services in a virtual fab (VF) environment with quality-of-service (QOS) guarantees. DMSPM exploits object-oriented technology to flexibly bind fab objects into services. To examine our ideas of DMSPM, the order commitment service (OCS) provided by foundry companies serves as a study case. A prototype is designed and implemented for realization of DMSPM in the OCS application by using the unified modeling language (UML) for object oriented modeling and a CASE tool for C++ code development. Results of experimentation with the prototype demonstrate both the ideas and the potential of DMSPM for application to virtual fab and e-business developments
Keywords
computer aided software engineering; computer integrated manufacturing; electronic engineering computing; integrated circuit manufacture; manufacturing data processing; object-oriented methods; object-oriented programming; outsourcing; software tools; specification languages; C++ code development; CASE tool; DMSPM; OCS application; QOS guarantees; delivery commitment; dynamic manufacturing service provisioning mechanism; e-business development; flexibly bound fab objects; foundry companies; manufacturing service provisioning; manufacturing services deployment; manufacturing services execution; object oriented modeling; object-oriented technology; order commitment service; prototype design; prototype implementation; quality-of-service guarantees; unified modeling language; virtual fab; virtual fab development; virtual fab environment; Computer aided software engineering; Foundries; Integrated circuit modeling; Manufacturing industries; Manufacturing processes; Object oriented modeling; Pulp manufacturing; Quality of service; Semiconductor device manufacture; Unified modeling language;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing Technology Workshop, 2000
Conference_Location
Hsinchu
Print_ISBN
0-7803-6374-4
Type
conf
DOI
10.1109/SMTW.2000.883091
Filename
883091
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