• DocumentCode
    2620049
  • Title

    Development of monolithic active pixel sensor in SOI Technology fabricated on the wafer with thick device layer

  • Author

    Kucewicz, W. ; Armstrong, B.M. ; Gamble, H.S. ; Grabiec, P. ; Kucharski, K. ; Marczewski, J. ; Maziarz, W. ; Niemiec, H. ; Ruddell, F.H. ; Sapor, M. ; Tomaszewski, D.

  • Author_Institution
    Department of Electronics, AGH-University of Science and Technology, al. Mickiewicza 30, 30-059, Krakow, Poland
  • fYear
    2008
  • fDate
    19-25 Oct. 2008
  • Firstpage
    1123
  • Lastpage
    1125
  • Abstract
    Monolithic active pixel detectors fabricated in SOI (Silicon On Insulator) technology are novel sensors of ionizing radiation, which exploit SOI substrates for the integration of readout electronics and a pixel detector. The fully depleted sensing diode has been manufactured under buried oxide (BOX) while read-out circuitry occupies upper silicon layer (‘device layer’). The development of the SOI detectors of ionizing radiation was started as a part of the SUCIMA project. During the project, it was proved that a monolithic SOI detector is a viable option for high-energy physics and medicine. The early prototypes suffered from significant leakage currents and soft breakdowns. These effects limited yield of production. Moreover, the p-wells (formed within the device layer and extended to the interface with the BOX), caused some local potential wells below the BOX at the top of depleted sensor area reducing the effective charge collection efficiency. The use a thicker device layer and optimized technology appeared to be a remedy.
  • Keywords
    Circuits; Diodes; Ionizing radiation; Ionizing radiation sensors; Manufacturing; Optimized production technology; Radiation detectors; Readout electronics; Silicon on insulator technology; Silicon radiation detectors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nuclear Science Symposium Conference Record, 2008. NSS '08. IEEE
  • Conference_Location
    Dresden, Germany
  • ISSN
    1095-7863
  • Print_ISBN
    978-1-4244-2714-7
  • Electronic_ISBN
    1095-7863
  • Type

    conf

  • DOI
    10.1109/NSSMIC.2008.4774598
  • Filename
    4774598