DocumentCode :
2620049
Title :
Development of monolithic active pixel sensor in SOI Technology fabricated on the wafer with thick device layer
Author :
Kucewicz, W. ; Armstrong, B.M. ; Gamble, H.S. ; Grabiec, P. ; Kucharski, K. ; Marczewski, J. ; Maziarz, W. ; Niemiec, H. ; Ruddell, F.H. ; Sapor, M. ; Tomaszewski, D.
Author_Institution :
Department of Electronics, AGH-University of Science and Technology, al. Mickiewicza 30, 30-059, Krakow, Poland
fYear :
2008
fDate :
19-25 Oct. 2008
Firstpage :
1123
Lastpage :
1125
Abstract :
Monolithic active pixel detectors fabricated in SOI (Silicon On Insulator) technology are novel sensors of ionizing radiation, which exploit SOI substrates for the integration of readout electronics and a pixel detector. The fully depleted sensing diode has been manufactured under buried oxide (BOX) while read-out circuitry occupies upper silicon layer (‘device layer’). The development of the SOI detectors of ionizing radiation was started as a part of the SUCIMA project. During the project, it was proved that a monolithic SOI detector is a viable option for high-energy physics and medicine. The early prototypes suffered from significant leakage currents and soft breakdowns. These effects limited yield of production. Moreover, the p-wells (formed within the device layer and extended to the interface with the BOX), caused some local potential wells below the BOX at the top of depleted sensor area reducing the effective charge collection efficiency. The use a thicker device layer and optimized technology appeared to be a remedy.
Keywords :
Circuits; Diodes; Ionizing radiation; Ionizing radiation sensors; Manufacturing; Optimized production technology; Radiation detectors; Readout electronics; Silicon on insulator technology; Silicon radiation detectors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nuclear Science Symposium Conference Record, 2008. NSS '08. IEEE
Conference_Location :
Dresden, Germany
ISSN :
1095-7863
Print_ISBN :
978-1-4244-2714-7
Electronic_ISBN :
1095-7863
Type :
conf
DOI :
10.1109/NSSMIC.2008.4774598
Filename :
4774598
Link To Document :
بازگشت