Title :
iNEMI’s gap analysis based on the 2007 electronics roadmap
Author :
Rae, Alan ; Pfahl, Robert C. ; Richardson, Charles
Author_Institution :
iNEMI 2214 Rock Hill Road, Suite 110, Herndon, Virginia 20170, USA
Abstract :
Participants from almost every sector of the global electronics industry - 565 individuals from 17 countries - contributed to the 2007 iNEMI Roadmap and identified key gaps and challenges facing the electronics industry that could impede further development in critical areas. These gaps were parsed based on their tactical or strategic focus and the Research Committee and Technical Committee of iNEMI prioritized these gaps with the aim of highlighting research needs to the electronics community, academia and government. This presentation outlines the process, the identified gaps and recommendations for action.
Keywords :
Business; CMOS technology; Components, packaging, and manufacturing technology; Conferences; Consumer electronics; Costs; Driver circuits; Electronics industry; Government; Thermal management;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties, and Interfaces, 2007. APM 2007. 12th International Symposium on
Conference_Location :
San Jose, CA, USA
Print_ISBN :
978-1-4244-1338-6
Electronic_ISBN :
1550-5723
DOI :
10.1109/ISAPM.2007.4419930