DocumentCode
2620192
Title
Supervised Laplacian Eigenmaps for Machinery Fault Classification
Author
Jiang, Quansheng ; Jia, Minping
Author_Institution
Sch. of Mech. Eng., Southeast Univ., Nanjing, China
Volume
7
fYear
2009
fDate
March 31 2009-April 2 2009
Firstpage
116
Lastpage
120
Abstract
Manifold learning is one of the efficient nonlinear dimensionality reduction techniques, which can be used to fault feature extraction. But they are not taking the class information of the data into account. In this paper, a new supervised Laplacian eigenmaps algorithm (S-LapEig) for classification is proposed first. Via utilizing class information to guide the procedure of nonlinear mapping, the S-LapEig enhances local within-class relations and help to classification. Based on the S-LapEig, a novel fault classification approach is proposed. The approach uses the S-LapEig to extract feature for class labels data, and utilizes RBF network to map the unlabeled data to the feature space, which easily implement pattern classification and fault diagnosis. The experiments on benchmark data and real fault dataset demonstrate that, the proposed approach excels compared to PCA and Laplacian eigenmaps, and it is an accurate technique for classification.
Keywords
data reduction; eigenvalues and eigenfunctions; fault diagnosis; feature extraction; learning (artificial intelligence); machinery; mechanical engineering computing; pattern classification; radial basis function networks; PCA; RBF network; S-LapEig algorithm; fault feature extraction; manifold learning; mechanical machinery fault classification; nonlinear dimensionality reduction technique; nonlinear mapping; pattern classification; supervised Laplacian eigenmap algorithm; Classification algorithms; Data mining; Fault diagnosis; Feature extraction; Laplace equations; Machinery; Manifolds; Pattern classification; Principal component analysis; Radial basis function networks;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Science and Information Engineering, 2009 WRI World Congress on
Conference_Location
Los Angeles, CA
Print_ISBN
978-0-7695-3507-4
Type
conf
DOI
10.1109/CSIE.2009.765
Filename
5170292
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