Title :
The mechanical behavior of conductors exposed to short-duration thermal loading
Author :
Watkins, R. ; Ravi-Chandar, K. ; Satapathy, S.
Author_Institution :
Dept. of Aerospace Eng. & Eng. Mech., Texas Univ., Austin, TX, USA
Abstract :
The current-carrying conductors in an electromagnetic (EM) launcher are exposed to high thermal loads that last for a few milliseconds. In some instances, the temperature increases range up to the melting point of the materials. Even though the equilibrium and creep behavior of materials at high temperature at long time scales is well characterized, such characterization is generally not available for thermal loads lasting for very short durations. Here, we study the mechanical properties, such as elastic modulus and yield strength, of commonly used conductors such as aluminum and copper alloys under millisecond-duration thermal loads. A pulser circuit is designed and used in conjunction with a tensile-testing machine to study property degradation concurrent with and subsequent to the application of the thermal load at different strain rates. The results of our study shall be used for generating constitutive descriptions of material behavior and in designing various components of the EM launchers.
Keywords :
conductors (electric); creep testing; elastic moduli; electromagnetic launchers; tensile testing; yield strength; aluminum alloys; conductors mechanical behavior; constitutive model; copper alloys; current-carrying conductors; degradation concurrent; elastic modulus; electromagnetic launcher; high-temperature materials properties; materials creep behavior; mechanical properties; millisecond-duration thermal loads; pulsed tensile tests; pulser circuit; short-duration thermal loading; strain rates; tensile-testing machine; yield strength; Aluminum; Conducting materials; Conductors; Copper alloys; Creep; Electromagnetic launching; Mechanical factors; Temperature distribution; Thermal conductivity; Thermal loading;
Conference_Titel :
Electromagnetic Launch Technology, 2004. 2004 12th Symposium on
Print_ISBN :
0-7803-8290-0
DOI :
10.1109/ELT.2004.1398062