• DocumentCode
    2620333
  • Title

    The mechanical behavior of conductors exposed to short-duration thermal loading

  • Author

    Watkins, R. ; Ravi-Chandar, K. ; Satapathy, S.

  • Author_Institution
    Dept. of Aerospace Eng. & Eng. Mech., Texas Univ., Austin, TX, USA
  • fYear
    2005
  • fDate
    25-28 May 2005
  • Firstpage
    138
  • Lastpage
    143
  • Abstract
    The current-carrying conductors in an electromagnetic (EM) launcher are exposed to high thermal loads that last for a few milliseconds. In some instances, the temperature increases range up to the melting point of the materials. Even though the equilibrium and creep behavior of materials at high temperature at long time scales is well characterized, such characterization is generally not available for thermal loads lasting for very short durations. Here, we study the mechanical properties, such as elastic modulus and yield strength, of commonly used conductors such as aluminum and copper alloys under millisecond-duration thermal loads. A pulser circuit is designed and used in conjunction with a tensile-testing machine to study property degradation concurrent with and subsequent to the application of the thermal load at different strain rates. The results of our study shall be used for generating constitutive descriptions of material behavior and in designing various components of the EM launchers.
  • Keywords
    conductors (electric); creep testing; elastic moduli; electromagnetic launchers; tensile testing; yield strength; aluminum alloys; conductors mechanical behavior; constitutive model; copper alloys; current-carrying conductors; degradation concurrent; elastic modulus; electromagnetic launcher; high-temperature materials properties; materials creep behavior; mechanical properties; millisecond-duration thermal loads; pulsed tensile tests; pulser circuit; short-duration thermal loading; strain rates; tensile-testing machine; yield strength; Aluminum; Conducting materials; Conductors; Copper alloys; Creep; Electromagnetic launching; Mechanical factors; Temperature distribution; Thermal conductivity; Thermal loading;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Launch Technology, 2004. 2004 12th Symposium on
  • Print_ISBN
    0-7803-8290-0
  • Type

    conf

  • DOI
    10.1109/ELT.2004.1398062
  • Filename
    1398062