DocumentCode
2620363
Title
First-principles simulation study on the effects of dopants on the cohesion of gold grain boundary
Author
Chew, Y.H. ; Wong, C.C. ; Bakar, Z. ; Ling, J.
Author_Institution
Materials & Applications Center, Kulicke and Soffa (S.E.A.) Pte. Ltd., #04¿05 TECHplace II, Block 5002, Ang Mo Kio Avenue 5, Singapore 569871
fYear
2007
fDate
3-5 Oct. 2007
Firstpage
314
Lastpage
318
Abstract
The effect of dopants on the cohesion of gold grain boundaries was investigated using the first-principles density functional theory of the thermodynamic model of Rice-Wang. Dopants that have a smaller diameter and lower electronegativity than gold are more beneficial on the cohesion of Au grain boundaries, which originate from both mechanical and electronic interaction, with the mechanical effect domineering. Dopants that bring up grain boundary cohesion should increase the ductility of Au wires. The method shows reasonable agreement with existing experimental data on calcium and berryllium-doped Au wires.
Keywords
Atomic measurements; Bismuth; Bonding; Chemistry; Doping; Gold; Grain boundaries; Grain size; Nickel; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties, and Interfaces, 2007. APM 2007. 12th International Symposium on
Conference_Location
San Jose, CA, USA
ISSN
1550-5723
Print_ISBN
978-1-4244-1338-6
Electronic_ISBN
1550-5723
Type
conf
DOI
10.1109/ISAPM.2007.4419945
Filename
4419945
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