• DocumentCode
    2620363
  • Title

    First-principles simulation study on the effects of dopants on the cohesion of gold grain boundary

  • Author

    Chew, Y.H. ; Wong, C.C. ; Bakar, Z. ; Ling, J.

  • Author_Institution
    Materials & Applications Center, Kulicke and Soffa (S.E.A.) Pte. Ltd., #04¿05 TECHplace II, Block 5002, Ang Mo Kio Avenue 5, Singapore 569871
  • fYear
    2007
  • fDate
    3-5 Oct. 2007
  • Firstpage
    314
  • Lastpage
    318
  • Abstract
    The effect of dopants on the cohesion of gold grain boundaries was investigated using the first-principles density functional theory of the thermodynamic model of Rice-Wang. Dopants that have a smaller diameter and lower electronegativity than gold are more beneficial on the cohesion of Au grain boundaries, which originate from both mechanical and electronic interaction, with the mechanical effect domineering. Dopants that bring up grain boundary cohesion should increase the ductility of Au wires. The method shows reasonable agreement with existing experimental data on calcium and berryllium-doped Au wires.
  • Keywords
    Atomic measurements; Bismuth; Bonding; Chemistry; Doping; Gold; Grain boundaries; Grain size; Nickel; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties, and Interfaces, 2007. APM 2007. 12th International Symposium on
  • Conference_Location
    San Jose, CA, USA
  • ISSN
    1550-5723
  • Print_ISBN
    978-1-4244-1338-6
  • Electronic_ISBN
    1550-5723
  • Type

    conf

  • DOI
    10.1109/ISAPM.2007.4419945
  • Filename
    4419945