Title :
In-situ thermal deformation measurement of low-k layer using nano-pattern recognition and correlation technique
Author :
Bi, Hongbo ; Han, Bongtae
Author_Institution :
Department of Mechanical Engineering University of Maryland College Park, MD 20742, USA
Keywords :
Conducting materials; Copper; Dielectric materials; Electrical resistance measurement; Integrated circuit interconnections; Pattern recognition; Thermal conductivity; Thermal engineering; Thermal resistance; Thermal stresses;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties, and Interfaces, 2007. APM 2007. 12th International Symposium on
Conference_Location :
San Jose, CA, USA
Print_ISBN :
978-1-4244-1338-6
Electronic_ISBN :
1550-5723
DOI :
10.1109/ISAPM.2007.4419946
