• DocumentCode
    2620380
  • Title

    In-situ thermal deformation measurement of low-k layer using nano-pattern recognition and correlation technique

  • Author

    Bi, Hongbo ; Han, Bongtae

  • Author_Institution
    Department of Mechanical Engineering University of Maryland College Park, MD 20742, USA
  • fYear
    2007
  • fDate
    3-5 Oct. 2007
  • Firstpage
    319
  • Lastpage
    320
  • Keywords
    Conducting materials; Copper; Dielectric materials; Electrical resistance measurement; Integrated circuit interconnections; Pattern recognition; Thermal conductivity; Thermal engineering; Thermal resistance; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties, and Interfaces, 2007. APM 2007. 12th International Symposium on
  • Conference_Location
    San Jose, CA, USA
  • ISSN
    1550-5723
  • Print_ISBN
    978-1-4244-1338-6
  • Electronic_ISBN
    1550-5723
  • Type

    conf

  • DOI
    10.1109/ISAPM.2007.4419946
  • Filename
    4419946
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2620380