DocumentCode
2620671
Title
A simulation study on basis material composition for dual energy CT imaging at high-energy level
Author
Duan, Xinhui ; Zhang, Li ; Cheng, Jianping ; Chen, Zhiqiang ; Xing, Yuxiang
Author_Institution
Department of Engineering Physics, Tsinghua University, Beijing, China
fYear
2008
fDate
19-25 Oct. 2008
Firstpage
1271
Lastpage
1273
Abstract
Quantitative dual energy computed tomography (DECT) allows to obtain both density and atomic number and thus can provide information about material composition. In this paper, a DECT reconstruction method for high energy X-rays (1 ∼ 10MV) is proposed based on a basis material decomposition model. Our method is to be adapted for cargo inspection. The difference from conventional DECT methods is derived from considering pair-production effect in reconstruction. This is unnecessary for DECT in usual energy level (lower than 1MV). Therefore, an approximation of the attenuation process is made: attenuation of photoelectric effect is ignored in our reconstruction due to its tiny contribution to total attenuation of multi-MV X-ray beams. Under this assumption, we set up our mathematical models based on the framework of the basis material method for DECT. Numerical experiments are performed to validate the effectiveness of our method. Results shows that our assumption and method are reasonable and feasible to be applied to real data. Discussion of the results and possible improvements for future work are presented in the end.
Keywords
Attenuation; Composite materials; Computational modeling; Computed tomography; Energy states; Image reconstruction; Inspection; Optical imaging; Reconstruction algorithms; X-ray imaging; computed tomography(CT); dual energy; high energy; reconstruction algorithm;
fLanguage
English
Publisher
ieee
Conference_Titel
Nuclear Science Symposium Conference Record, 2008. NSS '08. IEEE
Conference_Location
Dresden, Germany
ISSN
1095-7863
Print_ISBN
978-1-4244-2714-7
Electronic_ISBN
1095-7863
Type
conf
DOI
10.1109/NSSMIC.2008.4774637
Filename
4774637
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