An overview of electrical and mechanical aspects of electronic packaging

An overview of electrical and mechanical aspects of electronic packaging as they pertain to midrange and high-end computer systems is presented. Continued advances in semiconductor technology and manufacturing tools have fueled the expectation for continued greater function, higher performance, and lower costs in electronic systems. To meet this expectation, parallel progress in electronic packaging technology is necessary to realize the benefits of the VLSI technology advancements. Electrical and mechanical aspects of the electronic packaging structure-from the increased circuits per chip to the physical design of the electronic packaging-and future directions in packaging evolution are discussed. Innovations in single-chip and multichip modules, as well as the driving forces from the electrical requirements to the need of the physical design to meet wiring and performance demands are considered