DocumentCode
2621009
Title
Mechanical aspects of second level packaging interconnection methods
Author
Engel, Peter A.
Author_Institution
Dept. of Mech. & Ind. Eng., State Univ. of New York, Binghamton, NY, USA
fYear
1990
fDate
1-3 May 1990
Firstpage
2095
Abstract
Mechanical modeling of the main structural categories in second-level packaging is discussed, covering leadless chip carriers, pin-grid arrays, and flatpacks. Operational stress considerations focus on thermal loads, but manufacturing, handling, and dynamics are also considered. Development, test, and field conditions are related through mechanical analysis
Keywords
packaging; stress analysis; thermal stresses; J-lead; flatpacks; gullwing; interconnection; leadless chip carriers; mechanical analysis; mechanical modelling; pin-grid arrays; second level packaging; stress; thermal loads; Electronic packaging thermal management; Electronics packaging; Failure analysis; Integrated circuit interconnections; Lead; Strain measurement; Temperature; Thermal factors; Thermal loading; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 1990., IEEE International Symposium on
Conference_Location
New Orleans, LA
Type
conf
DOI
10.1109/ISCAS.1990.112206
Filename
112206
Link To Document