Title :
Mechanical aspects of second level packaging interconnection methods
Author_Institution :
Dept. of Mech. & Ind. Eng., State Univ. of New York, Binghamton, NY, USA
Abstract :
Mechanical modeling of the main structural categories in second-level packaging is discussed, covering leadless chip carriers, pin-grid arrays, and flatpacks. Operational stress considerations focus on thermal loads, but manufacturing, handling, and dynamics are also considered. Development, test, and field conditions are related through mechanical analysis
Keywords :
packaging; stress analysis; thermal stresses; J-lead; flatpacks; gullwing; interconnection; leadless chip carriers; mechanical analysis; mechanical modelling; pin-grid arrays; second level packaging; stress; thermal loads; Electronic packaging thermal management; Electronics packaging; Failure analysis; Integrated circuit interconnections; Lead; Strain measurement; Temperature; Thermal factors; Thermal loading; Thermal stresses;
Conference_Titel :
Circuits and Systems, 1990., IEEE International Symposium on
Conference_Location :
New Orleans, LA
DOI :
10.1109/ISCAS.1990.112206
