Title :
Multichip module technology at MCC
Author_Institution :
MCC, Austin, TX, USA
Abstract :
Wafer-scale interconnect problems and technological and cost objectives for multichip modules are examined. The performance potential of multichip packaging is discussed. Cu polyimide interconnect technology is discussed. Some problems and limitations in multichip packaging are described. Module connectors and cooling technology are discussed
Keywords :
cooling; heat sinks; hybrid integrated circuits; integrated circuit technology; metallisation; microassembling; modules; packaging; Cu; Cu polyimide interconnect technology; connectors; cooling; multichip modules; multichip packaging; wafer scale interconnects; CMOS technology; Clocks; Costs; Electronics packaging; Integrated circuit interconnections; Integrated circuit reliability; Manufacturing; Multichip modules; Power system interconnection; Printed circuits;
Conference_Titel :
Circuits and Systems, 1990., IEEE International Symposium on
Conference_Location :
New Orleans, LA
DOI :
10.1109/ISCAS.1990.112209
