Electronics packaging/interconnect: the next crisis

A study of the effect of changes in electronics packaging/interconnect (P/I) technology on military electronics is reported. The study was initiated after observing that the performance potential represented by advances in semiconductors has not been realized on the system level due to limitations imposed by P/I technology. It was also noted that packaging/interconnect is the primary source of reliability problems and the single biggest contributor to manufacturing cost. The 1991 state of packaging/interconnect technology (as used in both military and nonmilitary electronics) was examined and projections made to the year 2000. It was concluded that inserting P/I technologies developed for automotive, commercial, and consumer electronics into military applications is essential to attaining necessary cost-performance objectives for military electronics of the year 2000 and that this process will result in significant dislocations within the traditional military-electronics community. Actions to ensure the survival of an indigenous military-electronics capability are recommended