A multichip module integration technology on silicon substrate for high frequency applications

We present a planar low-cost multichip module integration technology on a silicon substrate. It is designed for high frequency applications where bare dice are placed in substrate openings and connected through a thin film multilayer realized in a planar fashion on top of the embedded system. We discuss the technological realization and resulting properties of the suggested MCM concept. The paper also addresses high frequency performance of the described interconnecting technology pointing out the benefits for RF circuit design. Exemplary we analyze a microstrip transmission-line crossing including a three-dimensional full-wave modeling of the structure with the time-domain transmission-line matrix method.