Title :
A multichip module integration technology on silicon substrate for high frequency applications
Author :
Mangold, T. ; Gulde, P. ; Neumann, G. ; Russer, P.
Author_Institution :
Lehrstuhl fur Hochfrequenztech., Tech. Univ. Munchen, Germany
Abstract :
We present a planar low-cost multichip module integration technology on a silicon substrate. It is designed for high frequency applications where bare dice are placed in substrate openings and connected through a thin film multilayer realized in a planar fashion on top of the embedded system. We discuss the technological realization and resulting properties of the suggested MCM concept. The paper also addresses high frequency performance of the described interconnecting technology pointing out the benefits for RF circuit design. Exemplary we analyze a microstrip transmission-line crossing including a three-dimensional full-wave modeling of the structure with the time-domain transmission-line matrix method.
Keywords :
UHF integrated circuits; integrated circuit interconnections; microstrip circuits; multichip modules; silicon; substrates; transmission line matrix methods; 3D full-wave modeling; HF performance; MCM integration technology; MCM-D technology; RF circuit design; Si; Si substrate; bare dice placement; embedded system; high frequency applications; microstrip transmission-line crossing; multichip module integration; planar low-cost integration technology; substrate openings; thin film multilayer; thin film wiring system; time-domain TLM method; transmission-line matrix method; Embedded system; Frequency; Integrated circuit interconnections; Multichip modules; Nonhomogeneous media; Paper technology; Silicon; Substrates; Thin film circuits; Transmission lines;
Conference_Titel :
Silicon Monolithic Integrated Circuits in RF Systems, 1998. Digest of Papers. 1998 Topical Meeting on
Conference_Location :
Ann Arbor, MI, USA
Print_ISBN :
0-7803-5288-2
DOI :
10.1109/SMIC.1998.750217
