• DocumentCode
    2622166
  • Title

    Modeling multilayered PCB power-bus designs using an MPIE based circuit extraction technique

  • Author

    Shi, Hao ; Fan, Jun ; Drewniak, James L. ; Hubing, Todd H. ; Van Doren, Thomas P.

  • Author_Institution
    HP-EESof Div., Hewlett-Packard Co., Santa Rosa, CA, USA
  • Volume
    2
  • fYear
    1998
  • fDate
    24-28 Aug 1998
  • Firstpage
    647
  • Abstract
    A circuit extraction tool (CEMPIE) has been developed based on the mixed-potential integral equation (MPIE) using a quasi-static approximation. A power-bus in a multi-layered PCB consisting of a pair of dedicated ground and power planes is studied using this tool. The distributed behavior of a power-bus is represented by a collection of passive circuit elements, which is valid up to several gigahertz. The decoupling performance of a power-bus due to its layer spacing and the dielectric constant is evaluated for simple test geometries. The impact of the relative distance between the noise source and the potential receiver is also studied. Novel structures such as a power island were studied in both thin and thick boards, and the decoupling performance due to the locations and values of the decoupling capacitors were also investigated
  • Keywords
    circuit analysis computing; equivalent circuits; integral equations; permittivity; printed circuit design; MPIE based circuit extraction technique; circuit extraction tool; decoupling capacitors; decoupling performance; dedicated ground planes; dedicated power planes; dielectric constant; layer spacing; mixed-potential integral equation; multilayered PCB power-bus designs; noise source; passive circuit elements; potential receiver; power island; power-bus; quasi-static approximation; test geometries; Admittance; Boundary conditions; Circuit noise; Circuit testing; Conductors; Geometry; Green´s function methods; Integral equations; Passive circuits; Transmission line matrix methods;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 1998. 1998 IEEE International Symposium on
  • Conference_Location
    Denver, CO
  • Print_ISBN
    0-7803-5015-4
  • Type

    conf

  • DOI
    10.1109/ISEMC.1998.750273
  • Filename
    750273